Ekopak Partner with the “Kiss the Future” AI Summit: Innovation and Responsibility for the Future
Sarajevo, 18 September 2026 - Ekopak is a partner of this year’s “Kiss the Future” AI Summit, which will take place in Sarajevo on 15 and 16 October 2026.
Although artificial intelligence and packaging waste recycling may at first seem to belong to entirely different fields, they are connected by one important question – how can we create solutions today for a more responsible and sustainable future?
The “Kiss the Future” AI Summit, which brings together experts, companies, and representatives from various industries to explore new technologies and their applications, provides Ekopak with an opportunity to demonstrate how major business and technology events can also take concrete steps towards more responsible packaging waste management.
During the two-day AI Summit, Ekopak will organise the separate collection of packaging waste. Specially marked recycling stations will be installed in front of the Sarajevo Youth Theatre and in the lobby of the Bosnian Cultural Centre, while volunteers will guide visitors on how to properly separate and dispose of different types of packaging waste. In cooperation with its partners, Ekopak will ensure that the collected packaging waste is properly managed and directed to recycling.
“Kiss the Future is about a future shaped by new technologies, and we want to remind people that the future is also shaped by how we manage the resources we use every day. This is why it is important for us to be part of an event that brings together people and companies focused on innovation, while ensuring that our partnership also has a very practical dimension. Visitors will be able to separate packaging waste at the point where it is generated, after which the collected quantities will be directed to recycling. In this way, we want to demonstrate that the proper disposal of packaging waste can and should be an integral part of organising major events,” said Amela Hrbat, Director of Ekopak.
The partnership with the “Kiss the Future” AI Summit will therefore go beyond simply supporting the event. Ekopak invites all visitors to get involved and make their own contribution by properly disposing of packaging waste generated during the Summit in the designated recycling stations, enabling it to be collected and directed to recycling.
The future is not only about new technologies – it is also about how we use resources and what we do with them after use.

